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TQ-Group, headquartered in Seefeld, Germany, is
a world-class supplier of embedded modules and
industrial PCs for electronics, automotive,
aerospace, and industrial automation
applications. |
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TQ Embedded Systems: For Reliable Embedded
Solutions |
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TQ Embedded Systems specializes in
high-performance, modular embedded computing
solutions for industrial, IoT, and communication
applications. With over 20 years of expertise,
we deliver scalable, long-lifecycle products
designed for durability, flexibility, and
seamless integration. |
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TQ maintains strategic partnerships with leading
semiconductor companies, including: |
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- Intel® – Titanium Partner in the
Intel® Partner Alliance.
- NXP® – Platinum Partner for
embedded processing platforms.
- Texas Instruments (TI) – Preferred
design partner for industrial-grade
ARM-based solutions.
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These alliances ensure early access to
cutting-edge processor technologies, optimized
design support, and long-term product
availability. |
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Partnership with ESS |
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TQ-Group has partnered with Embedded Systems
Solutions (ESS) to establish a global sales and
support network, enabling end-to-end lifecycle
services from concept through long-term
maintenance. |
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Why Choose TQ? |
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- End-to-End Solutions: From modules
to full systems.
- Global Support: Expertise in
integrating NXP, Intel®, and TI processors.
- Future-Ready: Designed for next-gen
networking and Industry 4.0
- Obsolescence Management: Ensures
long-term availability and reduces lifecycle
risks.
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TQ Product Range |
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TQ offers a broad portfolio—System on Modules (SoMs),
Starterkits, Single Board Computers (SBCs),
Embedded Box PCs, and Carrier Boards - across
form factors including COM Express® (Compact,
Mini, Basic, Type 6/10), SMARC® 2.1, COM-HPC®
Mini, and custom carrier boards. |
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Supported Architectures |
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| Architecture |
Key Features |
| x86 |
Intel® processors, COM Express®/SMARC
standards, scalable for IoT/IIoT
applications. |
| Arm® |
Cortex®-A series processors,
ultra-compact, low-power, ideal for edge
devices and embedded applications. |
| Power Architecture® |
Legacy QorIQ® T-Series with PowerPC
cores; proven in telecom and industrial
automation; long availability
guaranteed. |
| QorIQ® Layerscape |
Arm® Cortex®-A53/A72 based
high-speed networking processors;
optimized for secure, scalable, and
virtualized networks. |
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Application Domains |
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x86 Architecture
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TQ’s x86 portfolio leverages Intel® processors
to deliver real-time performance, longevity, and
wide temperature support—ideal for industrial
automation, aerospace/aviation, IoT/Industry
4.0, and beyond. All modules adhere to
industry-standard form factors (COM Express®,
SMARC 2.1, COM-HPC® Mini), simplifying upgrades
and carrier-board reuse. |
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System on Modules (SoMs)
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SOM integrates a processor, memory, power
management, and essential interfaces into a
compact board to board module. Designers use
SOMs to minimize development time and focus on
application specific carrier boards. |
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Module : TQMx130HC
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| Feature |
Specification |
| Processor |
13th Gen Intel® Core™ ("Raptor Lake-P H45"), up to 14 cores (6 Performance + 8 Efficient), 96 EU Iris Xe GPU, up to 5.0 GHz |
| Form Factor |
COM Express Compact Type 6, 95 x 95 mm |
| Memory |
DDR5-5200 SO-DIMM, up to 64 GB (2 SO-DIMMs) |
| Graphics |
Up to 4 independent 4K display outputs, 3x DisplayPort/DP++ 1.4a (up to 8K), 1x eDP or LVDS |
| Interfaces |
1x 2.5 GbE (Intel i226-TSN), 4x USB 3.2 Gen 2, 8x USB 2.0, 16x PCIe Gen4 lanes, SATA 3.0, UART, I2C, SMBus, SPI, LPC, GPIO, MIPI-CSI |
| Operating Temp. |
Standard: 0 °C to +60 °C; Extended (HRE): -40 °C to +60 °C |
| Highlights |
High-end multi-thread performance, AI-boost with VNNI + DP4a, PCIe Gen4, industrial use conditions, pin-to-pin compatible upgrade of TQMx120HC |
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Module :
TQMxE39S |
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| Feature |
Specification |
| Processor |
Intel Atom® x5/x7 E3900 series ("Apollo Lake-I"), Dual/Quad-core up to 2.5 GHz; also supports Pentium®/Celeron® |
| Form Factor |
SMARC 2.0/2.1 (82 mm x 50 mm) |
| Memory |
LPDDR4 up to 8 GB; eMMC Flash up to 64 GB (soldered) |
| Graphics |
Triple Display: 1x DP 1.2a / HDMI 1.4b, 1x eDP / LVDS, 1x HDMI 1.4b; 2x MIPI CSI |
| Interfaces |
1x GbE (Intelx i210), 2x USB 3.0, 4x USB 2.0, USB OTG, 1x SATA, 4x PCIe, SD card, IxC, SPI, UART, SMBus, HDA |
| Operating Temp. |
Standard: 0°C to +60°C; Extended: -40°C to +85°C |
| Highlights |
Robust design, optional conformal coating, real-time support, medical & industrial use, power efficient (3-8 W typical) |
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Other Prominent x86 SoM’s
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TQMxE40S – SMARC 2.1 module with Intel Atom®
x6000 (“Elkhart Lake”), up to 3.0 GHz,
triple 4K display, PCIe Gen3.
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TQMx80UC – COM Express® Compact Type 6
module with 8th Gen Intel® Core™, triple 4K
displays, 64 GB DDR4.
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TQMxE41S – SMARC 2.1 module with Intel Atom®
x7000E/RE, Core™ i3, N-series CPUs, LPDDR5,
AI acceleration.
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TQMx110EB – COM Express® Basic Type 6 module
with 11th Gen Intel® Core™/Xeon® W-11000E,
PCIe Gen4, 64 GB DDR4.
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TQMxE40M – COM Express Mini Type 10 module
with Intel Atom® x6000 (“Elkhart Lake”), up
to 3.0 GHz, dual 4K display, PCIe Gen3
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Starterkits (Evaluation Kits)
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Starterkits bundle a SOM with a matching
carrierboard, power supply, cooling solution and
example software, allowing rapid prototyping and
evaluation. |
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Starter Kit: STKx80UC
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| Feature |
Specification |
| Based On Module |
TQMx80UC (COM Express® Compact Type 6) |
| Evaluation Board |
Carrier board with full I/O breakout and expansion slots |
| Connectivity |
4x USB 3.1 Gen 2, 4x SATA (6 Gb/s), PCIe, GbE, Display interfaces |
| Power Input |
Via external power supply, regulated for module use |
| User Interfaces |
Power/reset buttons, status LEDs, debug UART |
| Expansion Options |
PCIe lanes, SODIMM memory slot, display headers, and peripheral interfaces |
| Temperature Range |
Standard (0°C to +60°C), based on module variant |
| Purpose |
Evaluation and development for high-end computing and graphics applications |
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Other Prominent Starterkits
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Box PCs |
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BoxPCs integrate SBCs into rugged enclosures
with extended I/Os and power options, ideal for
industrial and mobile applications. |
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Carrier Boards
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Carrier Boards provide essential interfaces and
connectivity for modular Computer-on-Modules (COMs)
such as SMARC and COM Express. They enable
flexible prototyping and development, allowing
engineers to evaluate and customize embedded
systems with ease using various processor
modules. |
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Carrier Board: MB-SMARC-2 |
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| Feature |
Specification |
| Compatible Modules |
SMARC 2.0/2.1, short and full-size x86 / Arm® modules |
| Graphics Interfaces |
1x Dual-channel LVDS (w/ backlight, control/power), 1x eDP, 1x HDMI, 1x DP |
| Ethernet |
2x Gigabit Ethernet |
| USB Interfaces |
1x USB 3.0, 1x USB 2.0, 1x USB 2.0 pin header, 1x USB 2.0 OTG, 1x USB Type-C |
| CAN Bus |
2x CAN FD (galvanically isolated) |
| MIPI CSI |
2x MIPI CSI (for camera modules) |
| Audio |
1x Audio jack (Mic Line In/Out, Headphone) |
| Storage Expansion |
1x Micro SD card socket |
| Expansion Interfaces |
1x PCIe x1, 1x Mini PCIe (PCIe + USB 2.0 + micro SIM), 1x M.2 Key E (USB/PCIe) |
| Power Supply |
CR2032 battery (replaceable), onboard power/reset buttons |
| Purpose |
Evaluation and development with SMARC 2.0/2.1 SOMs, industrial and embedded use |
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Other Prominent Carrier Boards
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For the full lineup of x86-based SoMs,
Starterkits, Carrier Boards, and Embedded Box
PCs, visit:
https://www.tq-group.com/en/products/tq-embedded/x86-architecture/ |
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Arm® Architecture
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TQ's Arm® portfolio delivers scalable,
energy-efficient embedded solutions tailored for
industrial automation, HMI, AI/ML, and IoT
applications. Leveraging processors from NXP,
Renesas, and Texas Instruments, these modules
support industry-standard form factors like
SMARC 2.1 and TQ LGA, ensuring design
flexibility and longevity. |
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System on Modules (SoMs)
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TQ's Arm®-based SoMs integrate processors,
memory, and essential interfaces into compact
modules, reducing design effort and
time-to-market. |
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Module: TQMa8XxS |
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| Feature |
Specification |
| Processor |
NXP i.MX8X with Arm® Cortex®-A35 (Dual/Dual Plus/Quad Plus), Cortex®-M4 co-processor |
| Form Factor |
SMARC 2.0 / 2.1 (82 x 50 mm, 314 pins) |
| Memory |
LPDDR4 up to 4 GB, eMMC up to 64 GB, Quad SPI NOR up to 256 MB |
| Graphics |
3D GPU support, 2x LVDS, 1x eDP |
| Interfaces |
2x Gigabit Ethernet, 1x PCIe, 1x USB 3.0, up to 5x USB 2.0, 2x CAN FD, 2x UART RS232, 1x MIPI CSI |
| Other Interfaces |
SDIO/MMC, I°C (up to 2), SPI, I°S, GPIO, JTAG |
| Operating Temp. |
-40°C to +85°C (extended), -25°C to +85°C (standard) |
| Highlights |
DSP for audio, low power (~4 W), optional SE050 Secure Element, RTC, temperature sensor |
| Power Supply |
3.3 V (optional 3.0 V to 5.25 V) |
| OS Support |
Linux, PikeOST, QNX, Android (on request) |
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Module: TQMa93xxLA |
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| Feature |
Specification |
| Processor |
NXP i.MX 93xx with Arm® Cortex®-A55 (Single/Dual Core) and integrated NPU (0.5 TOPS) |
| Form Factor |
TQ LGA (38 x 38 mm, 281 pins) |
| Memory |
LPDDR4 up to 2 GB, eMMC up to 256 GB, QSPI NOR up to 256 MB |
| Graphics |
LVDS (4-lane), MIPI-DSI (4-lane) |
| Interfaces |
2x CAN FD, 2x USB 2.0, up to 2x GbE (1x TSN), 8x UART, IxC, SPI, SDIO, MIPI-CSI |
| Operating Temp. |
-40°C to +85°C (extended), -25°C to +85°C (standard) |
| Highlights |
Integrated ML accelerator (0.5 TOPS), low power (~2W), real-time processing, optional Secure Element |
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Other Prominent SoM’s
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Starterkits (Evaluation Kits)
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Starterkits bundle an Arm SoM with a matching
carrier board, heat sink, cables, and example
software, allowing rapid prototyping and
evaluation. |
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Model: STKa8MxML
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| Feature |
Specification |
| Based On Module |
TQMa8MxML |
| Processor |
NXP i.MX 8M Mini with Arm® Cortex®-A53 cores |
| Graphics |
Integrated GPU with hardware acceleration for video encoding/decoding |
| Interfaces |
HDMI, LVDS, MIPI-DSI, USB, Ethernet, CAN, UART |
| Operating Temp. |
-40°C to +85°C |
| Highlights |
High-performance multimedia support, industrial-grade design |
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Other Prominent Arm Starterkits
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Embedded Box PCs |
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Embedded Box PCs integrate an Arm SoM, carrier
board, and rugged chassis to deliver
ready-to-deploy, fan-less systems suitable - for
industrial applications. |
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Model: ABox-8MPxL |
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| Feature |
Specification |
| Based On Module |
TQMa8MPxL |
| Processor |
NXP i.MX 8M Plus Quad-Core Cortex®-A53 with Cortex®-M7 (for RT),
2.3 TOPS NPU for AI/ML acceleration |
| Graphics |
HDMI, DisplayPort, MIPI DSI, LVDS; VPU with H.264/H.265 encoding/decoding; 2x MIPI-CSI2 camera interfaces |
| Interfaces |
2x Gigabit Ethernet (1x TSN), 2x USB 3.0, 2x CAN FD (galv. isolated),
4x DI / 4x DO, UART, IxC, SPI, Audio |
| Operating Temp. |
Standard: -25?° C to +70?° C, Extended: -40?° C to +70?° C |
| Highlights |
Low power (typ. 4?W), HiFi4 DSP, SE050 secure element, real-time clock, analog inputs, ISO7816/14443, M.2 |
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Single Board Computers (SBCs) |
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TQ's Single Board Computers (SBCs) offer a fully
integrated carrier board with multiple I/O and
expansion slots, ideal for embedded system
integrators seeking a compact, production-ready
platform. |
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Model: MBa8MP-RAS314 |
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| Feature |
Specification |
| Based On Module |
TQMa8MPxL |
| Processor |
NXP i.MX 8M Plus Quad-Core Cortex®-A53 with Cortex®-M7 (for RT), 2.3 TOPS NPU for AI/ML acceleration |
| Graphics |
HDMI, LVDS, MIPI DSI (2 lanes); 1x MIPI CSI2 camera (2 lanes) |
| Interfaces |
2x Gbit Ethernet (1x TSN), 4x USB 3.0 host, 1x USB 3.0 device,
1x Audio jack, PWM, up to 28x GPIO |
| Operating Temp. |
Standard: -25°C to +70?°C, Extended: -40°C to +70°C |
| Highlights |
WiFi 5, SE050 secure element, RTC, SD card, UART, I°C, SPI,
Compact 100°100mm, low power (typ. 3 W) |
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Other prominent Single board computers (SBCs) |
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For the full lineup of Arm-based SoMs, SBCs,
Starterkits, and Embedded Box PCs,
visit:
https://www.tq-group.com/en/products/tq-embedded/arm-architecture/
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Power Architecture
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TQ’s Power Architecture® modules, built on NXP’s
QorIQ® T-series, offer high-speed data transfer,
real-time performance, and long-term
availability - ideal for industrial networking,
telecom, and aerospace systems. Their compact
form factor and rich I/O make integration simple
and scalable. |
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System on Modules (SoMs)
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SoMs are compact CPU boards with processor,
memory, and I/O, designed for flexible embedded
system integration. TQ’s Power SoMs enable fast,
reliable development for telecom, defense, and
aerospace platforms. |
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Embedded Module: TQMT1042 |
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| Feature |
Specification |
| Based On Module |
TQMT1042 |
| Processor |
Quad-core NXP QorIQ® T1042 e5500 (64-bit) up to 1.4 GHz |
| Graphics |
Display controller for TFT LCD displays (up to 24-bit RGB) |
| Interfaces |
5x Gigabit Ethernet (with IEEE® 1588v2), 2x USB 2.0 High Speed Host/Device/OTG,
2x SATA 2.0, 4x PCIe 2.0, 4x IxC, 1x eSPI, 2x DUART, Up to 32x GPIO
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| Operating Temp. |
Standard: 0°C to +70°C, Extended: -40°C to +85°C |
| Power Consumption |
Typ. 5 W up to 7 W |
| Plug-in System |
Board-to-Board 360-pin |
| OS Support |
Linux, PikeOST (on request) |
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Starter Kits for Rapid Development |
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Starter Kits provide a comprehensive evaluation
platform, including the SoM, baseboard, power
supply, and necessary accessories, enabling
quick prototyping and development. |
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Starter Kit: STKT1042 |
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| Feature |
Specification |
| Based On Module |
TQMT1042 |
| Evaluation Board |
Carrier board with full I/O breakouts for development and testing |
| Connectivity |
5x Gigabit Ethernet, 2x USB 2.0, 2x SATA 2.0, 4x PCIe, Display Interface, IxC, eSPI, Serial Ports |
| Power Input |
Via external connector (typically 12V input regulated for SoM use) |
| User Interfaces |
Reset and power buttons, debug UART header, status LEDs |
| Expansion Options |
PCIe sockets, debug connectors, GPIO headers |
| Temperature Range |
Standard & extended (depends on module variant used) |
| Purpose |
Rapid evaluation and development for TQMT1042 module |
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For the full lineup of Power-based SoMs and
Starter kits:
Visit :
https://www.tq-group.com/en/products/tq-embedded/power-architecture/
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QorIQ® Layerscape: Powering Next Gen Embedded
Systems
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TQ’s QorIQ® Layerscape portfolio harnesses NXP’s
Arm®-based processors to deliver secure,
high-speed data processing for
performance-critical industrial, networking, and
edge computing applications. Featuring
multi-core scalability, real-time
virtualization, and advanced I/O, these modules
support compact form factors and long-term
availability - ideal for next-generation
industrial networking, firewalls, and
virtualized infrastructure. |
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System on Modules (SoMs)
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TQ’s QorIQ® Layerscape SoMs integrate
high-performance Arm® Cortex®-A72/A53
processors, memory, power management, and
essential interfaces into a compact
board-to-board module. By separating
application-specific carrier design from core
processing, they accelerate development and
enable scalable, space-efficient solutions with
long-term availability. |
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Model: TQMLS1046A |
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| Feature |
Specification |
| Processor |
NXP LS1046A, Quad-core Arm® Cortex®-A72 @ 1.8 GHz |
| Memory |
Up to 8 GB DDR4 with optional ECC; up to 64?GB eMMC |
| Networking |
2x 10 GbE + up to 10x 1 GbE Ethernet interfaces |
| I/O & Interfaces |
3x USB 3.0, 3x PCIe?3.0, UART, IC, SPI, SATA, SDIO |
| Rugged Design |
80 x 60 mm; -40 °C to +85 °C; 420-pin board-to-board |
| Power |
5?V supply; on-board voltage monitoring & RTC |
| OS Support |
Linux (default); VxWorks available on request |
| Security & Reliability |
Integrated Trust Architecture, temperature sensor |
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Model: TQMLX2160A |
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| Feature |
Specification |
| Processor |
NXP LX2160A, up to 16 x Arm® Cortex®-A72 @ 2.2?GHz |
| Memory |
2x DDR4 (up to 64?GB) with ECC; eMMC up to 64?GB |
| Networking |
2x 100 GbE, 16x 10/25?GbE, 2x GbE |
| I/O & Interfaces |
6x PCIe Gen3 (24 lanes), 4x SATA 3.0, 2x USB 3.0, 2x CAN FD, SPI, IxC, UART |
| Security & Compression |
Integrated Trust Architecture; 100?Gbps data compression engine |
| Form Factor |
126 x 78 mm; board-to-board plug-in system (560 pins) |
| Operating Temp. |
Standard: -25 °C to +85 °C; Extended: -40 °C to +85 °C |
| OS Support |
Linux (default); VxWorks on request |
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Other SoM’s
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Starterkits |
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Starterkits integrate SoMs with carrier
hardware, IO, and software examples - perfect
for evaluated development and proof-of-concept. |
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Model: STKLX2160A
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| Feature |
Specification |
| Based On Module |
TQMLX2160A with up to 16x Arm® Cortex®-A72 (NXP QorIQ LX2160A) |
| Evaluation Board |
Carrier board with full I/O breakouts for high-speed interface evaluation |
| Connectivity |
2x 100G Ethernet, 2x USB 3.0, 2x CAN FD, PCIe Gen4, up to 24x SerDes lanes |
| Memory Support |
2x DDR4 with ECC (up to 64 GB) |
| Power Input |
External power connector (5V regulated for module and peripherals) |
| User Interfaces |
Reset/power buttons, status LEDs, debug UART |
| Expansion Options |
PCIe sockets, SATA, I²C, SPI, GPIO headers |
| Temperature Range |
Standard and extended (-40 °C to +85 °C, depending on module variant) |
| Purpose |
High-performance development platform for networking, edge server & data routing |
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Other Starterkits
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For the full lineup of Power-based SoMs and
Starterkits:
Visit :
https://www.tq-group.com/en/products/tq-embedded/power-architecture/
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Single Board Computers (SBCs) |
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TQ’s Single Board Computers integrate processor
modules, memory, power management, and I/O onto
a compact, ready-to-use platform - ideal for
rapid prototyping and deployment. |
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Box PCs |
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BoxPCs offer fully enclosed, fanless embedded
systems with rugged I/O and high reliability. |
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For the full lineup of QorIQ-based SoMs, SBCs,
Starterkits, and Embedded Box PCs:
Visit :
https://www.tq-group.com/en/products/tq-embedded/qoriq-layerscape/ |
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